HS-405 series through-hole copper paste is developed to solve many problems that are easy to occur in the current flexible circuit board (FPC) material and hole plugging process. It is a highly reliable copper paste material for hole filling, especially suitable for the process of conducting after lamination.
The conductive paste mixes the low melting point metal powder and the high melting point metal powder with the resin, and cures the resin by heating, so as to provide the support skeleton after the plug hole, and endow it with heat resistance and chemical resistance; Through heating and semi sintering, the mutual melting and conduction are made and the alloy (IMC layer) is formed, so as to achieve a highly reliable conductive paste resistant to vibration and heat. It is widely used in semiconductor and vehicle industry.
